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MicroNanoSystems News
Bumping with nano light
Replicating
THE UNIVERSITY OF GHENT (UGent)
success
and IMEC demonstrated repulsive and
attractive nanophotonic forces,
depending on the spatial distribution of REPLISAURUS TECHNOLOGIES has
the light used. These research results announced a common laboratory
may imapct telecommunication and agreement with CEA-Leti. The
optical signal processing. agreement marks a step towards
Photon impulse is usually release of Replisaurus’ innovative
considered to be relatively weak. In our ElectroChemical Pattern Replication
macroscopic world, photons bumping (ECPR) metallization process.
into an object exert an almost acting as movable strings. They have a Replisaurus and Leti personnel will
negligible force on this object. width of 445nm, a height of 220nm, a collaborate and take advantage of the
Nevertheless, this picture changes length of approximately 25µm and they experience in both semiconductor and
dramatically when the object size is are separated by a 220nm gap. MEMS technology, and expertise with
Issue V 2009
shrunk to nanoscale dimensions. When By sending laser light through the 200mm and 300mm wafer
square4
light is confined to very small cross waveguides the researchers generated technologies. The team will initially
.com
sections and large gradients exist in the optical forces between them. focus on optimizing the development
spatial field distribution of the light, the Depending on the spatial distribution of of reusable master electrodes, a key
optical gradient force induced per the light (both in amplitude and phase) component of the ECPR process which
photon increases dramatically. the strings were attracting or repulsing employs a template to fabricate metal
Using advanced fabrication each other. The repulsive force that had patterns in a single replication step.
technologies the researchers created never been demonstrated before makes They will also investigate the
two parallel waveguides on a SOI chip. this experiment of fundamental opportunities for ECPR in new
oasiasemiconductor
The waveguides are freestanding, scientific importance. applications, notably in key growth
.eur
sectors such as integrated passives,
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copper pillars and 3D integration. The
team will optimize electrode design
9
Bonding for 3D
and fabrication flow for each
application area, ensuring the best
yield, endurance and cycle time.
applications
In order to create a platform to
build its mastering business,
Replisaurus has started a new
company called Replisaurus Mastering,
SUSS MICROTEC and IMEC have wiring, silicon is removed from the and the program is already up and
entered a joint development program. bottom of the substrate to open the running at Leti’s facility in Grenoble.
They will develop permanent bonding, buried TSVs. Dies or wafers The ECPR process reduces
temporary bonding and debonding subsequently are stacked and metallization complexity and
processes for 3D system integration, interconnected in a wafer bonding step. accelerates production by eliminating
including TSV manufacturing. “We are very pleased to co- many steps from the traditional
IMEC will use SUSS MicroTec’s develop with SUSS MicroTec the process. ECPR also provides improved
XBC300 production wafer bonder processes for permanent and temporary patterning and significant cost and
platform to develop 200 and 300mm wafer bonding for our 3D time savings, with a fab friendly,
permanent metallic interconnect technologies,” said Eric Beyne, Program environmentally clean process that
bonding, as well as temporary bonding Director of IMEC’s Advanced Packaging doesn’t use solvents or strippers.
and debonding solutions for its 3D- and Interconnect Research Centre. “The The development program will
stacked Interconnect and 3D Wafer debonding and handling of very thin explore 3D technology and
Level Packaging technology. wafers ranging from 25 to 50µm is a applications and employ technology
For its 3D IC technology, IMEC challenging and critical process.” from Replisaurus subsidiary SET.
uses a process flow where TSVs are “Working with IMEC, an “CEA-Leti has advanced
realized in a single-damascene process exceptional research facility, on 300mm capabilities with CMOS and MEMS
that is performed immediately after 3D development for temporary and applications that will be a great
front end and contact processing but permanent bonding applications is an testbed for our technology as we look
prior to processing of the back-end exciting opportunity for the SUSS to apply it in other application areas,”
metallization layers. This process MicroTec company,” said Wilfried Bair, said Alan Cuthbertson, vice president
enables small via diameters of 1-5µm. General Manager, SUSS MicroTec’s of Mastering Technology at
After completion of the back-end Bonder Division. Replisaurus.
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