Company News
Seeking defects together
FEI COMPANY has joined SEMATECH’s detailed information about physical
Advanced Metrology Development structure, atomic arrangement, chemical
Program at the College of Nanoscale bonding, density, and electronic
Science and Engineering (CNSE) of the behavior on a nm scale. The result is a
University at Albany. much more complete profile of each
As a member of this program, FEI material than would have been possible
will collaborate with experts in with a smaller set of techniques.
SEMATECH’s Metrology divisions to “The integration of FEI’s TEM with
develop high resolution capabilities of EELS is a leading candidate to replace
TEM analysis, with electron energy loss SEM based EDX for inline elemental
spectroscopy (EELS) and FIB technology analysis of defects for the 45nm node accelerating nanoscale innovations.”
to address critical needs in process and below,” said Brad Thiel, CNSE Integration of new materials into
development and defect analysis. These Associate Professor of Nanoscience and semiconductor devices requires
tools will provide the high resolution Director of SEMATECH’s Advanced advanced analytical characterization
imaging and compositional data on the Metrology Development Program at the techniques such as the high-resolution
scale of a few nanometers, which is UAlbany NanoCollege. imaging capabilities afforded by TEM.
invaluable for defect analysis. “We are pleased to welcome FEI to FIB technology is uniquely suited for
Analytical TEM has historically been the growing roster of companies preparing ultrathin TEM samples from
used for basic research in advanced engaged in nanoelectronics research even the smallest device features.
materials development. However, as and development at the UAlbany SEMATECH’s Advanced Metrology
electronic devices approach the NanoCollege,” said Richard Brilla, VP Development Program at the UAlbany
nanometer scale, defects consisting of for strategy, alliances and consortia at NanoCollege is assessing and
even a few atoms become critical. The CNSE. “This collaborative relationship developing new characterization
combination of both TEM and EELS is with FEI further demonstrates the technologies that will address current
uniquely powerful in that it provides success of the SEMATECH-CNSE in and projected metrology gaps.
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.eur Extending lithography
oasiasemiconductor
GLOBAL LITHO SERVICES (GLS) has experienced management team and installation of the first systems at a
announced its opening this week, advanced expertise of its technical staff prominent US semiconductor
providing services and pre-owned ensure a unique and high quality manufacturer.
lithography equipment to the mature proposition. GLS offers attractively Erik Corduwener, Managing
semiconductor, MEMS, and niche priced solutions to customers requiring Director for Global Litho Services,
.com
application markets. hardware and process support that is stated, “We are very excited about the
Registered in the Netherlands, typically not available from the OEM. launch of Global Litho Services. It is
Global Litho Services specializes in GLS has already successfully unique in its kind. We have an
square4
Issue V 2009
trading, selling and servicing of pre- secured supply of various types of pre- extremely skillful team of people with
owned lithography systems, offering owned wafer steppers. The compelling extensive semiconductor & MEMS
high quality equipment and support at GLS proposition has been proven knowledge specific to lithography
very competitive prices. The through the recent sale, delivery, and equipment and its applications.”
Electroglas seeks Chapter 11
ELECTROGLAS has announced that the company has filed a At the same time, the company has been working with
voluntary petition under Chapter 11 of the U.S. Bankruptcy Needham & Company, LLC and others to review and pursue
Code. As a result of the global economic recession, financial and strategic options for the company.
demand for semiconductor manufacturing equipment has The current plan is for certain of our bondholders to
declined dramatically. Over the past several months, provide Debtor in Possession (“DIP”) financing to sustain the
Electroglas has undertaken efforts to reduce expenses and Company during the bankruptcy process and for the
working capital in response to these market conditions. Company to conduct an auction to sell the Company. In the
These efforts have included significant work force reductions, meantime the company expects to continue essential
salary cuts, mandatory time off for all of the company’s operations, including sales, product support, service and
employees and significant decreases in non labour expenses. warranty programs.
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