Semicon West continues to thrive
Semicon West
continues to thrive
Semicon West was thriving this year as visitors from Silicon Valley and beyond
converged on the Moscone Convention Center in downtown San Francisco to
see the latest development s in electronics packaging and to visit a new show,
co-located on the third floor of Moscone West – Intersolar USA.
Intersolar confused a number of visitors as
many of the exhibits demonstrated finished
solar solutions, rather than manufacturing
equipment and material per se. Other
than a handful of suppliers, there was little
synergy between both events (see Editorial
on page 1).
Many of the new developments
at Semicon West were from materials
suppliers. Here is a roundup on what
was new at the show:
3M introduced a new Universal Cover
Tape for component reels. The new tape
has adhesive on one side and a second
liner down the middle to stop outgassing or
adhesive contamination into the devices.
The tape has peel initiation marks and
is manufactured 1-2mm from the edge, to look at sub-micron samples of small Asymtek demonstrated their new DJ9500
only covering the component. 3M claims parts in 3D. jet inside the S920 dispenser. This new head
this new tape avoids mispicks and missing preheats fluids to reduce their viscosity,
components in SMT placement. The tapes One of the coolest developments at the then reduces the viscosity further by using
come in three variations, non-conductive, show were the new series of burn-in test the needle heater prior to dispensing. This
static dissipative and conductive. sockets from Aries. The new, injection application is useful for high UPH materials,
molded sockets can accommodate any size such as underfills and reduces cycle times.
of device up to 6.5mm
2
. The sockets can Another new nozzle is designed for
test flip chips, CSPs, µBGA and more. dispensing silicon with phosphor for high-
Larger versions are available as 13mm
2
, brightness LEDs. The nozzle provides a
27mm
2
, 40mm
2
and 55mm
2
. The pogo clean snap-off and a 7x speed increase over
pins used with the sockets are made to its predecessor.
Aries’ own design in Switzerland and are The S822 batch dispenser demonstrated
assembled in the US using US springs. a unique new application. Using a
piezo-electric jet they dispensed lines of
conductive epoxy around a seven-layer
stacked die. This alternative to gold
bonding offered a significant speed increase
and 15-20% saving in materials cost.
Agilent introduced a new R&D tool for BTU demonstrated their Pyramax 12 zone
measuring fatigue, creep, topography and oven, which can offer up to three spike
resistance. The Nano Indentation machine zones and a four lane configuration for
uses an Atomic Force Microscope (AFM) small board applications, such as telecoms.
58 – Global SMT & Packaging - August 2008 www.globalsmt.net
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