Understanding hidden reactions and the importance of profile in reflow soldering, part 2
Acknowledgements
The authors would like to acknowledge
the support provided by Mr. Abhinav
Ajmera, graduate research assistant in the
Center for Electronics Manufacturing and
Assembly, for reviewing the article.
Authors
Dr. Ramkumar is the director of the
Center for Electronics Manufacturing
and Assembly (CEMA) at the Rochester
Institute of Technology, Rochester NY.
Mr. Anand Kannabiran was a graduate
research assistant in CEMA and is
currently working as a process engineer
in Vansco Electronics.
Ms. Aarthi Baskaran is a graduate
teaching assistant in CEMA.
Dr. Viswam Puligandla is a retired
scientist from Nokia.
Mr. Bjorn Dahle is the president of
KIC Thermal.
References:
Figure 7. Sn-Ni binary system phase diagram.
1. Tz-Cheng Chiu, Kejun Zeng,
Roger Stierman, Darvin Edwards
Components & Technology Packaging Materials Science IX:
and Kazuaki Ano, “Effect of
Conference 2004. Symposium Held December 2-5,
thermal aging on board-level drop
2. P.G. Kim, K.N. Tu, “Fast soldering 1996, Boston, Massachusetts.
reliability”, Proceedings of Electronics
reactions on Au foils”, Electronic
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www.globalsmt.net Global SMT & Packaging - August 2008 – 29
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