New Products
New products
essemtec’s semi-automated paste
30 mm to a maximum of 510 x 360 mm,
auto-Dip lead-free mass soldering
printer features vision system
instead of the present 410 mm x 360 mm.
replaces manual methods
Essemtec’s SP003-ML-V stencil printer is a
www.jas-smt.com
highly reliable system aimed at small and
medium production volumes. Precise paste
industry responds to FcT solder’s
print on every PCB with high consistency
Nc162 no clean liquid flux
is key for the successful manufacture of
FCT Solder, a division of FCT Assembly
high-quality, reliable electronic products.
and an authorized licensee of Nihon
With the SP003-ML-V, control of print
Superior Co. Ltd.’s SN100C product line,
quality and correction of print position is
said that it has recently seen an increase in
made easy and fast using the integrated vi-
sales of NC162, a lead-free, halide-free, no-
sion system, which consists of two quick-fix
clean liquid flux. With an increase in the
cameras that can look directly through the
number of accounts switching to Nihon
stencil apertures down to the PCB.
Superior’s SN100C bar solder, the sales
www.essemtec.com
of NC162 also are increasing. Customers
are impressed with its performance and
A new lead-free solder dipping system is
New option for the expansion of the
rightfully so because NC162 was specifi-
reportedly finding wide acceptance among
circuit board spectrum to 510 mm
cally formulated for use with SN100C. It
PCB through-hole assemblers requiring a
also works great with SAC305 and 63/37
higher-throughput mass soldering capability
processes.
www.fctassembly.com
than labor-intensive hand methods. Mann-
corp’s Auto-Dip is a bench-top fixtureless
environment-friendly solvent
system that simulates the action of a wave
cleaning
system without the risk of dislodging
ZESTRON® VD, designed for cleaning as-
components when boards of any shape,
semblies with complex geometries, provides
retained by a grid of needle supports, are
excellent performance in capillary spaces
dipped into the solder bath. Solder is then
and is therefore recommended for the re-
evenly applied while surface tension ‘floats’
moval of contaminants from low standoffs,
the PCBs at correct through-hole wetting
which are difficult to access. ZESTRON®
height.
www.manncorp.com
VD is used in one-chamber solvent clean-
Have you purchased a KE-2070 or KE-2080
ing equipment. Due to the completely
suss MicroTec introduces next gen-
component mounter for circuit boards
water-free process, a fast and residue-free
eration manual mask aligner
up to a maximum size of 410 x 360 mm
drying even of high drag-out components
SUSS MicroTec launched the third genera-
and now see yourself confronted with new
can be realized.
tion of its MA/BA8, a manual mask and
production requirements? Juki now offers
The continuous regeneration of the
bond aligner that offers highest process
an economical solution. With the L-wide
cleaning medium in the closed-loop sys-
flexibility including submicron alignment
option for their KE-2070 and KE-2080
tems ensures extremely small consumption
and exposure optics dedicated for thick
machines, the circuit board spectrum can
and therefore reduced cleaning agent costs.
resist exposure. In addition it allows easy
be expanded from a minimum of 50 x
www.zestron.com
and fast upgrades to emerging technologies
from thin-film technologies to photovoltaic-production innovation all along the line
new munich trade fair centre
10–13 november 2009 18th international trade fair for
www.productronica.com innovative electronics production
72 – Global SMT & Packaging – November 2008
www.globalsmt.net
p09_PVdu_203x76,5gSMTpaINT_E 1 08.09.2008 15:01:51 Uhr
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