TitleGlobal Technology Awards
Flux Materials inspection equipment—
Cobar—XF3 Solder Paste X-ray
The perfect combination of the VJ Electronix—Vertex Series A
unique SN100C-alloy and the X-Ray Inspection System
advanced polymer XF3 paste-flux To meet significant industry chal-
technology eliminate voids dramatically. lenges, the Vertex Series “A” x-ray inspec-
SN100C-XF3 solder paste provides shiny tion system from VJ Electronix has many
solder joints similar to SnPb. The alloy is innovative features that help the customer
eutectic. The Ni addition eliminates the inspect PCB and component assemblies
micro cracks and rearranges the Sn den- quickly and accurately. The Vertex Series
drites on the solder surface into a more “A” is designed to be used on the produc-
refined granular structure. XF3 provides superb print definitions, tion floor; its small footprint allows x-ray
even with the smallest apertures such as the 01005 configuration, capabilities to be used in a space smaller
with cost-saving IPC class 3 powder.
www.cobar.com than or equal to a conventional AOI ma-
chine. Yet the Vertex Series “A” can fully inspect PCBs up to 24 x
hand soldering/rework/repair 20”, which means that multiple assemblies can be inspected at one
R & D Technical Services—Vapor Works 24 time. The Vertex Series “A” is under $100K.
www.vjelectronix.com
Rework Station
Hot air and IR rework stations may pick & place equipment—low to Medium Volume
bring issues such as overheating, Europlacer—iineo Placement System
shadowing, deflection and reflection The iineo platform uses the company’s proven core features—turret
to rework. These are non-issues in head, intelligent feeders and powerful software—to reach placement
the new V-Works 24 single-compo- rates up to 26,000 cph.
nent vapor rework station, making Flexible changeover is a key
it a highly cost efficient system. feature for today’s multiple
Components and boards are safe job processing, and with the
from damage, thus saving thousands,
!
iineo, setup for multiple job processing
perhaps millions of dollars, depending on the application. is done automatically, requiring little
www.rdtechnicalservices.com changeovers. The iineo featureslue dis-
pense with Archimedean screw, electrical
iD systems test, fixed camera, conveyor auto-width
Polyonics—XF-546 Polyimide Label adjustment, special nozzle magazine and
Material more.
www.europlacer.com
Polyonics XF-546 is a polyimide label
material with a permanent pressure pick & place equipment—high Volume
silicone adhesive and a high opacity, Juki—FX3 Placement System
medium gloss white topcoat specifi- This is the first machine in the
cally designed for thermal transfer marketplace that will do high speed,
printing. The printed polyimide label high quality assembly at a reasonable
resists smearing, so no labels will cost. The price point is about 30%
have to be replaced or reprinted, speeding up the process. Each of a comparable machine The
polyimide label produced can withstand process temperatures up FX3’s innovative design allows the
to 1,000°F (538°C), depending on time exposure. The labeling machine to still run if one nozzle is
is compatible with all of the leading cleaning chemistries on the broken, on its remaining 5 heads.
market today, so they can be cleaned right along with the board, This machine is extremely versatile
saving time.
www.polyonics.com and can place parts from 00105
to 0402s to 35mm accuracy. Juki
inspection equipment—aoi machines are shown to have an excess of fifteen years of useful life,
Koh Young—aSPire 3-D Inline Solder and the FX3 offers the only three-year full warranty in the market-
Paste Inspection System place, regardless of hours the machine has run.
www.juki.co.jp/smt
Today’s ever-smaller SMT packages require
precisely accurate volumetric measure- printing equipment
ment of deposited solder paste. Reflec- DEK—Dual Lane Printing Solution
tivity of materials (specular issues) and Dual Lane from DEK is an in-line print-
shadowing make this accuracy difficult to ing solution delivering a 100% increase
achieve without true 3D measurement. in throughput, dramatically reduced
aSPIre technology, based on a panoramic downtime and extensive process
illumination/collection concept, gives the flexibility. Deploying two DEK
user true 3D height and volume measure- printers in configuration, Dual
ment, unrivalled <<10% GR&R on 01005. Lane doubles throughput without
Shadow-free 3D measurement ensures a high level of precision and compromising line footprint in a
accuracy, and in this automated system, ensures repeatability. significant advance over conven-
www.kohyoung.com tional single lane operation. DEK’s
40 – Global SMT & Packaging – November 2008
www.globalsmt.net
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