Title
around
the world
IMAPS 2008 APEX
November 2-6 2009 March 31-April 02, 2009
Providence, RI Las Vegas, NV, USA
Stand 115-17
NEPCON China 2009
Virtual PCB April 21-24, 2009
November 12-13, 2008 Shanghai, People’s
Online:
www.virtual-pcb.com Republic of China
2009 Pan Pacific SMT/HYBRID/
National Electronics
Conference PACKAGING
Week
February 10-12, 2009 May 5-7, 2009
June 16-18, 2009
Big Island, HI, USA Nuremberg, Germany
Earls Court, London, UK
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The Global Assembly Journal for SMT and Volume 9 Number 9 September 2008
Advanced Packaging Professionals Check out clips and interviews from
akellard@globalsmt.net
ISSN 1474 - 0893
the show floor at SMTAI 2008 at
smtai.globalsmt.net. What you’ll find:
United States—Lino D’Andreti
Tel: +1 (603) 580-5549
– Indium’s Rick Short and Tim Jenson
ldandreti@globalsmt.net
discuss Indium8.9’s ability to elimi-
nate the ‘head in pillow’ defect.
Asia/Pacific—Amanda Tan
– MIRTEC’s Brian D’Amico demos
Tel: 852- 6339 6969
board inspection for Global SMT &
atan@globalsmt.net
Neil MacRaild
Interview Inside
Packaging’s Trevor Galbraith.
OPTIMIZING BATCH CLEANING FOR REMOVING NEW PRODUCTS
LEAD-FREE FLUX RESIDUES ON PCAS – Balver Zinn’s Paul Salmon talks Korea—S.I. Yun
INDUSTRY NEWS
COMPATIBILITY OF POLYMERS AND FLUXES: GET-
TING TO THE HEART OF THE MATTER
INTERNATIONAL DIARY about ‘fundamentally a new flux Tel: +82-31-781-9171
A BREATH OF FRESH AIR
system.’
siyun@globalsmt.net
– and more!
www.globalsmt.net Global SMT & Packaging – November 2008 – 75
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