Global Technology Awards
unique technology overcomes the traditional issues associated with for high-throughput, low
dual lane printing concerning space-consuming machine layouts maintenance operation. Its
and eliminates the need for installations that stagger printers at unique design and dross manage-
the head of the line or complex conveyor systems.
www.dek.com ment system drastically cuts
dross production, for materials,
programming operation, and cost savings.
BPM Microsystems—
www.vitronics-soltec.com
Flashstream Flash Memory
Programmer Family soldering Materials
Nine times faster than its nearest Pfarr Stanztechnik GmbH—BiSn42
competitor, the innovative Flash- Ribbon and Preform
stream vector programming system The eutectic composition Bi(58) Sn(42) is
offers the fastest flash programming insertable for soldering temperature-sensitive
of NAND and NOR flash memory electronic components. Due to his low melting
at speeds as low as 2.5 percent over point it`s possible to operate at low soldering
theoretical programming minimum, temperatures. Possible fields of application are
meeting a significant industry special requirements in semiconductor assembly
challenge. An addition of multiple and high frequency technology or as fusible
automated handling solutions for electronic manufacturers has bee safety devices. PFARR offers this soldering
made to the Flashstream, requiring high volumes flash memory composition for high quality applications in
that now are causing production bottlenecks.
www.bpmicro.com customised dimensions with close tolerances. The special adjusted
production process allows manufacturing of accurate preforms,
selective soldering equipment ribbons, foils and spheres.
www.pfarr.de
ERSA—VERSAFLOW Selective Soldering System
ERSA VERSAFLOW 3/45 Test equipment
revolutionizes in-line selective Mirtec—MV-7L Inline AOI System
soldering for high volume, The MV-7L offers advanced 4-megapixel
high quality applications with digital color camera technology in an
world’s first dual track capability. in-line AOI system with an optional Side
Highest volume throughput is Viewer® camera system that adds four
achieved at minimum floor space 2-megapixel side view digital color
requirement due to simultane- cameras. The available Intelli-Scan®
ous processing of as many as 16 Laser System provides “The Third Di-
PCBs. Typical mass production wave soldering mension in Inspection Capability”—the
jobs can now be transferred to the VERSAFLOW ability to precisely measure the Z-height
tremendously increasing quality with enormous of any given region of interest. This
cost savings.
www.ersa.de revolutionary technology yields absolute
detection of lifted leads on gull wing
software devices and true coplanarity testing of BGA and CSP devices and
Juki—OPASS Software is NOT available on any other AOI system!
www.mirtecusa.com
OPASS is the first totally built-in machine solution for correc-
tion of assembly on boards that allows for stretch and twist of Wafer-level products (tie)
circuit patterns. All corrections are done in the machine without Zygo Vision Systems—AV9000 Advanced
additional inspection systems, conveyors or software. The OPASS IC Packaging Inspection System
software allows correction by 3 additional vision shots that take The AV9000 advanced IC package
less than 1 second per board. This allows the most accurate inspection system gives customers a
placement in the business, which will platform with a lower cost of owner-
correct problems and allow the line ship and up to 70 percent performance
to flow smoothly, without stoppage improvement over the proven AV6010
and produce the best boards in the inspection systems. The true 3-D metrology
industry. capability on the AV9000 has also been
www.jas-smt.com extended to support inspection of solder
bump heights as small as 15 micron.
www.zygo.com
soldering equipment AWPb 300 wafer bumper system
Vitronics Soltec—Delta 3 Wave Soldering System AWPb 300 is a creative and cost
Vitronics Soltec’s Delta 3 represents a new class of wave system efficient application of Milara’s
manufactured for global markets, offering high quality and capabil- existing technology and is capable of
ity yet with a lower initial investment and lower cost of ownership, handling 200/300mm cassettes with
for faster payback. It is also unusually flexible; it can be config- either a single or dual FOUP option,
ured for mixed production of bare PCBs and pallets allowing for meeting a significant industry chal-
different profiles and solderpot clearance. Its solderpot is built lenge.
www.milarasmt.com
50 – Global SMT & Packaging – November 2008
www.globalsmt.net
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