Global Technology Awards
Global Technology Awards
A profile of the leading technology companies whose innovations
won them 2008 Global Technology Awards.
The fourth annual Global Technology Awards ceremony was held at SMTA International 2008 in August and continued the trend of being
even more of a success than previous years. The awards recognize the very best new innovations in the printed circuit assembly and packaging
industries. New categories for 2008 included flux materials, pick & place: low to medium volume and pick & place: high volume. A team of
international judges selected the best innovations for electronics manufacturing products and services introduced between July 2007 and July
2008. The result was a celebration of some extremely innovative technology that deserves the description ‘the best in the world.’
adhesives/coatings/encapsulents
SonoTek—SonoFlux 2000 FP
SonoFlux spray fluxing systems, with a stationary, non-clogging
ultrasonic nozzle and spray dispensing mechanism have been proven
in thousands of industrial PCB fluxing applications worldwide. The
SonoFlux 2000FP system is designed with a high transfer efficiency spray
assembly and a closed spray chamber, to capture any flux vapor in the
environment. The system is also equipped with a high velocity flux transfer
system, to help with PCBs that have difficulty with topside
fill, such as those with thick back planes, tight lead-to-hole
ratios or contaminated components.
www.sono-tek.com
assembly Tools
FCT Assembly—Slic-Blade Squeegee Blades
The surface of the Slic-Blade squeegee blades is very smooth and
slick, eliminating the issue of solder paste sticking to the blade.
There is less bridging, reduced paste shear breakdown and faster
print speeds when using this product. The Slic-Blade is solid nickel and
will not chip or flake as coated blades do. This allows the Slic-Blade to
be re-sharpened when it becomes dull, lowering cost of ownership. Only
periodic sharpening is needed to keep the Slic-Blade operating at its
maximum efficiency.
www.fctassembly.com
Bonding equipment
Hesse & Knipps—PiQC (Proces integrated Quality
Control)
In response to the need for more accurate bond quality
control, Hesse & Knipps has developed the Process
Integrated Quality Control system (PiQC), a multi-dimensional control system that
monitors the most significant bonding process values for judging bond quality. These
measures can include mechanical deviation, transducer current, wire deformation,
resonance frequency and the scrub behavior during the welding process. It acquires
data in parallel to the bond process to avoid impact on machine throughput, offering a
neutral 100% quality control.
www.hesse-knipps.com
cleaning equipment
Aqueous Technologies—Trident Automatic Defluxing
and Cleanliness Testing System
The Trident batch-format acqueous defluxing system is
capable of removing all flux residues including rosin, no-clean, and water soluble.
Both leaded and lead-free flux residues may be removed using Trident. This is the
only machine on the market capable of doing this. Trident is equipped with an au-
tomatic chemical injection system that automatically adds a programmable volume
34 – Global SMT & Packaging – November 2008
www.globalsmt.net
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80