Sober outlook . . . not a big surprise
• entered a lease agreement for 106,000 nomic slowdown. Juki Automation Systems moved to a 2x
SF of manufacturing space in Hang- Asymtek moved to a new expanded larger location in Nürnberg Germany.
zhou, China, with production begin- Singapore location to meet increasing fluid Kulicke & Soffa sold its wire business unit
ning 1Q’09. dispensing equipment demand. to W.C. Heraeus GmbH.
• began manufacturing Kirby Lester Christopher Associates retained Jasbir Manncorp released an ‘auto-dip’ lead-free
pharmacy automation systems in Buf- Bath as consulting engineer for its solder- mass soldering system.
falo Grove, IL. ing materials. Methode Electronics introduced a new
Propartner (based in Høgås, Norway) filed Corelis expanded its existing Cerritos, CA, conductive silver nanoparticle ink with low
for bankruptcy. facility by over 30% to meet demand for electrical resistance.
Rimaster started production in Louny, new test products in boundary scan and OK International appointed Eric Chen
Czech Republic. JTAG. China sales director.
Salcomp: DEK and Scanditron began laser cut sten- Omron introduced revamped inline 3-D
• is centralizing its Finish activities in cil production cooperation for the Polish solder paste inspection system.
Salo and closing its Kemijärvi office by market. Prodelec opened a new SMT equipment
April 2009. DEK introduced a new 2D Inspection sales and service entity in Ariana, Tunisia.
• CFO Antti Salminen is resigning. (2Di) V9 software tool. Siemens formed Siemens Electronics
Service Engineering added 12,000 SF to Dow Chemical entered into a term loan Assembly, a wholly-owned subsidiary of
its Greenfield, IN, facility. agreement of up to $13 billion to partially Siemens Drive Technologies.
SigmaTron cut staff at its Elk Grove finance its Rohm & Haas acquisition. It Soldertec Global is launching a new test-
Village plant to 150 and shifted jobs to sees this deal closing in early 2009. ing service that enables engineers and PCB
Acuna, Mexico and China. DuPont named Ellen Kullman CEO. buyers to assess and maintain the quality of
Sparton received NYSE non-compliance Eagle Test Systems added Camstar’s Elec- their incoming gold over nickel PCBs.
notification after its market CAP fell below tronics Suite to its company-wide manufac- Speedline received three SMT China Vi-
$75 million over a 30 trading-day period. turing processes. sion Awards at the Nepcon China.
Vaasa Componenta (Finland) filed for Enthone (Cookson Electronics) acquired Tektronix will open Test & Measurement
bankruptcy. Ormecon from Emerald Technology Centers of Excellence in Santa Clara, CA,
VirTex Assembly received a PCB contract Ventures. Shanghai, Taipei and Tokyo.
from BPM Microsystems. Essemtec introduced FLX2010C with Teradyne acquired Eagle Test for $250
Winland Electronics named David Kuklin- vacuum hold-down for flex board compo- million.
ski director of sales. nent placement. Trace Laboratories opened Shanghai,
Wipro opened a second manufacturing GE Capital Solutions, Global Electronics China test laboratory.
unit in Kotdwar, India for servers, storage, Services named Dan Hamling director, IC Tyco Electronics is closing its Berga,
notebooks, desktops and allied IT electron- test and assembly. Spain, and Val de Reuil and Chapareillan,
ics. iNEMI initiated three PCB quality control France, plants resulting in 850 eliminated
Xenterio added a fifth SMT line. projects that establish a standard meth- jobs.
odology for assessing functional-test fault Yamato Kagaku rolled out a new 3D X-ray
Materials & process equipment coverage, encourage wider adoption of CT analyzer with 1.5 micron resolution for
Akrometrix named Nicolas Khoury presi- boundary scan by components manufac- the analysis of semiconductor devices and
dent and CEO, Dr. Qingying Hu director turers, and create a method for testing multilayer boards.
of R&D and Michael Zhu director of sales, mechanical performance of printed-circuit
China. assemblies. components
Assembléon is significantly reducing its ISRA VISION developed a 100% in-line • California listed gallium arsenide as a
global workforce due to the current eco- printed electronics inspection system. carcinogen.
Continued on page 31
20081012 20081011
Global "Electronic Foodchain" Outlook
Worldwide Semiconductor Capital Spending
2009 vs 2008
$ Billions
70.0
63.4
Combined GDP
HV 2
60.0
60.0
-25.7% 59.0
52.8
50.0
47.1
47.9
Electronic Equipment
HV 2 41.1
40.0
30.0
Rigid & Flex PCBs
HV 3
20.0
10.0
Semiconductors HV
5
0.0
2006 2007 2008 2009 2010 2011 2012
Other Capital Spending 17.9 18.7 13.6 10.6 11.5 16.6 12.6
Semi Capital Equipment
-9 Gartner
Automated Test Equip 4.1 3.6 2.6 2.7 3.5 3.2 3.8
Packaging & Assembly Equip 5.4 5.2 4.3 4.3 5.4 4.8 5.5
-10 -5 0 5
Wafer Fab Equip 32.5 36.0 26.6 23.4 27.5 34.4 31.0
% Change
Gartner 10/2008
Chart 9. Chart 10.
www.globalsmt.net Global SMT & Packaging – November 2008 – 27
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