Test data requirements for assessment of alternative Pb-free solder alloys
Table 1. Summary of test methods, parameters, controls, and reporting requirements for the assessment of new Pb-free solder alloys.
Reliability
Test and method Test parameters Control(s) Report
Accelerated thermal cycling Test condition: TC1 (0°C to 100°C) with 10 minute ramps SnPb, Weibull curves for each alloy combination.
IPC-9701-A and 10 minute dwells, 6000 cycles or failure of all SAC305,
components, whichever occurs first. SAC105 Tabulated failure data for each alloy combination.
Solder paste and BGA/CSP ball PCB: HP standardized test board, 0.093 inches thick,
alloys six layers, 1/2 oz copper foil, OSP surface finish, non Thermal profile used for testing.
solder-mask defined (metal-defined) pads for area array
components
Components: Standardized BOM with BGAs andTSOPs,
with silicon die and daisy chains as per IPC-9701-A
• Type II TSOPs with Fe-Ni Alloy 42 leads
• BGAs with 1.27 mm or 1.0 mm pitch
• BGAs in the following combinations:
1. SnPb ball alloy and SnPb paste
2. SAC305 ball alloy and SAC305 paste
3. New alloy ball and new alloy paste
4. Different combinations depending on material:
a. If evaluating solder paste alloy, test combination
of SAC105 alloy ball and new alloy paste
b. If evaluating BGA /CSP ball alloy, test
combination of new alloy ball and SAC105 paste
Samples: 32 of each alloy combination
Preconditioning: Test boards must be placed in an oven
within 24 hours of assembly and baked in air at125°C
for 48 hours for lead-free and 24 hours for the tin-lead
boards, and then tested within one week.
Mechanical shock Test Condition: B, 1500 G, 0.5 ms duration, SnPb, Report as per Section 8 of JESD22-B111 for all test conditions,
JESD22-B111 half-sinepulse. SAC405 including eight Weibull curves (one for each surface finish and alloy
PCB: HP standardized test board as per Section 5.2, 1 combination).
Solder paste andBGA/CSP ball alloys mm thick, eight layers, 1+6+1 build-up, both OSP and
electrolytic Ni/Au (not ENIG), non solder-mask defined Tabulated failure data for all four alloy combinations for both
(metal-defined) pads surface finishes, as specified in section 7 of JESD22-B111.
Components: Standardized BOM with area arrays with
silicon die and daisy chains as per JESD22-B111, no PTH Reflow profile from the test vehicle assembly.
or leadframe components, package surface finish OSP
or SOP, two types of components: 0.50 mm and 1.0 mm
pitch (no larger than 15 mm x 15 mm), BGAs/CSPs in the
following combinations:
1. SnPb ball alloy and SnPb paste
2. SAC405 ball alloy and SAC405 paste
3. New alloy ball and new alloy paste
4. Different combinations depending on material:
a. If evaluating solder paste alloy, test combination
of SAC405 ball and new alloy paste
b. If evaluating BGA/CSP ball alloy, test combination
of new ball alloy and SAC405 paste
Samples: Test 32 components for each combination of
finish, pitch, ball and paste alloy PCB finish (OSP and
Ni/Au) and for each of the four combinations of reflow
alloy and ball alloy, for a total of 512 components. Four
components on each test board, each combination of
PCB finish, pitch, and alloy require eight boards, for a total
of 128 boards.
Preconditioning: Test boards must be placed in an oven
within 24 hours of assembly and baked in air at125°C
for 48 hours for lead-free and 24 hours for the tin-lead
boards, and then tested within one week.
Vibration Test condition: Method 2, with sweeps for the discovery SnPb, Report for all test conditions, as per IEC 60068-2-64, including:
IEC 60068-2-64 of resonant points. SAC405 • Initial inspection results
PCB: Same as mechanical shock test board, 1 mm thick, • Response graphs indicating the stress applied (power density
Solder paste andBGA/CSP ball alloys eight layers, 1+6+1 build-up, both OSP and electrolytic Ni/ charts)
Au (not ENIG), non solder-mask defined (metal-defined) • Resonant frequencies
pads • Dwell time at each resonant frequency
Components: Same as mechanical shock, area arrays • Results from final inspection
with silicon die and daisy chains as per JESD22-B111, • Test observations
no PTH or leadframe components, package surface finish • Photographs of failed samples
OSP or SOP, two types of components: 0.50 mm and 1.0 • Comparison of performance found between new alloy and
mm pitch (no larger than 15 mm x 15 mm), BGAs/CSPs in controls
the following combinations: • Photographs of the test set-up, with details indicating the
1. SnPb ball alloy and SnPb paste mounting of the test vehicle to the vibration table
2. SAC405 ball alloy and SAC405 paste • Location of accelerometers
3. New alloy ball and new alloy paste • Type of test equipment used (hardware and software)
4. Different combinations depending onmaterial: • Calibration records of the test equipment
a. If evaluating solder paste alloy, test combination
of SAC405 ball and new alloy paste
b. If evaluating BGA/CSP ball alloy, test combination
of new alloy ball and SAC405 paste
Samples: Test 32 components for each combination of
finish, pitch, ball and paste alloy PCB finish (OSP and
Ni/Au) and for each of the four combinations of reflow
alloy and ball alloy, for a total of 512 components. Four
components on each test board, each combination of
PCB finish, pitch, and alloy require eight boards, for a total
of 128 boards.
Preconditioning: Test boards must be placed in an oven
within 24 hours of assembly and baked in air at125°C
for 48 hours for lead-free and 24 hours for the tin-lead
boards, and then tested within one week.
14 – Global SMT & Packaging – November 2008
www.globalsmt.net
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