Contents
Global SMT & Packaging
Volume 8, No. 8
is published monthly
by Trafalgar Publications
August 2008
Limited. The journal is
FREE to qualified
professionals and is
available by subscription
at a cost of $380.00 for the
current volume (twelve issues).
Periodicals postage paid at
Contents
American edition
Rahway NJ. Postmaster send
address corrections to:
Global SMT & Packaging, c/o
2 Solar technology clouds the landscape
Mercury International Limited,
Trevor Galbraith 12
365 Blair Road, Avenel,
NJ 07001.
teChnology FoCus
No part of this publication may
12 Advances in solder ball placement for
be reproduced, stored in a
surface-mountable packages
retrieval system, transmitted in
Tom Falcon, DEK Printing Machines Ltd
any form or by any means;
22 Understanding hidden reactions and the
electronic, mechanical,
importance of profile in reflow soldering, part 2
photocopying, recording or
42
Dr. S. Manian Ramkumar, Mr. Anand Kannabiran
otherwise without the prior
and Ms. Aarthi Baskaran, CEMA at RIT;
written consent of the publisher.
Dr. Viswam Puligandla; Mr. Bjorn Dahle, KIC
No responsibility is accepted for
the accuracy of information
42 Parallel print & inspection processes to
contained in the text,
achieve 100% post-print inspection
illustrations or advertisements.
Wolfram Hübsch, ERSA GmbH
The opinions expressed in the

articles are not necessarily those
speCial FeatuRes
of the editors or the publisher.
36 Company Profile: NBS Design
ISSN No. 1479-9650
38 Case Study: KIC’s 24-7 continuous monitoring
© Trafalgar Publications Ltd
system helps Paramit meet its zero-defects objective
40 Interview—Don Naugler, VJ Electronix, Inc.
Designed and Published by
50 SMTA International 2008 Show Preview
Trafalgar Publications Ltd,
56 GlobalTRONICS 2008 Show Preview
Bournemouth, United Kingdom
58 SEMICON West continues to thrive
Printed by Ovid Bell Press Inc.
Missouri, USA
40
RegulaR Columns otheR RegulaR FeatuRes
4 Wafer level packaging 8 Industry News
and the third dimension 62 Association News
Joe Fjelstad 64 International Diary
6 SMART Group launches
“Lead-Free Process Defect Guide 2”
Bob Willis
30 Seasonal upturn imminent
but soft demand through 2009
Walt Custer and Jon Custer-Topai
46 Update on lead-free solder joint reliability
Front cover image: Juki placement
machines at NBS Design’s newly
Werner Engelmaier
expanded Santa Clara, California, facilities
www.globalsmt.net Global SMT & Packaging - August 2008 – 1
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