Industry news
about how they help with NPI. as the leader in a technology that promises
www.cooksonelectronics.com to expand the capabilities and cut the
costs and power consumption of mobile
New and revised Flexible handsets, according to iSuppli Corp.
Circuit Technology chapter Munich-based Epcos this year said it would
addendum available take over Netherlands-based NXP’s RF
Four new and updated chapters have been MEMS business with the anticipation it
released online to complement Flexible will develop into a product line worth
Circuit Technology’s 3rd Edition and are a nearly one billion euros. Terms of the deal
Appointments
must-read for those looking to understand were not disclosed. iSuppli believes that
this very important technology. The within the next few years, Epcos is likely to
chapters, authored by Werner Engelmaier, become a leading supplier to the mobile-
CyberOptics’ Steve DiMarco Engelmaier Associates; Kevin M. Durocher handset industry.
www.isuppli.com
promoted to new role and William E. Burdick, GE Research;
CyberOptics Corporation recently Bob Willis, SMART Group; and Joe EI Technologies hosted IPC
promoted Steven DiMarco to vice Fjelstad, developer of the Occam Process, Technology Interchange event
president & general manager, inspection can be downloaded free from Endicott Interconnect Technologies,
systems business, which produces AOI
www.flexiblecircuittechnology.com. Inc. (EI) hosted an IPC-sponsored
and solder paste inspection systems for event entitled “Will You Be Ready?: An
the global electronics industry. 2008 European Electronic Assembly Endicott Technology Interchange” at its
DiMarco will be responsible for Reliability Summit headquarters in Endicott, N.Y. in May.
CyberOptics’ new systems product A European and international conference The event included a tour of the facility,
development and manufacturing center on reliability in electronic assemblies will presentations from EI’s top technologists
in Singapore as well as global sales & be held at the Tallink Spa & Conference and a panel discussion featuring leading
marketing and service. He has been Hotel in Tallinn, Estonia, October industry suppliers.
with CyberOptics since 2005, most 22nd–24th 2008. “The event opened the communication
recently as the company’s vice president “This technical conference is being channel between original equipment
of sales & marketing. held at a critical time for the electronics manufacturers, electronic manufacturing
industry,” said Dr. Jeremy Pearce, service providers, and the supply chain for
Dan Hoz Appointed as Valor CEO technology networks manager at Soldertec information exchange and networking,”
Dan Hoz has been officially appointed Global. “New assembly methods and said Voya Markovich, senior VP and CTO
as President and CEO. Hoz, the materials have introduced uncertainties at EI.
www.endicottinterconnect.com
company’s CFO for the past five years, about long term reliability, especially in
is replacing former CEO Ofer Shofman harsh environments that need urgent and FINE LINE STENCIL stays at
who announced his retirement after 15 complex technical solutions.” top of industry with its technical
years in the company, six of which as The conference is co-organized support services
president and CEO. Hoz was perceived by Soldertec Global and Global FINE LINE STENCIL, a division of FCT
as a natural candidate for the job, SMT & Packaging. www. Assembly, believes that customer service is
and the company’s board of directors
europeanelectronicsummit.com key to staying successful in today’s industry.
believes that he will be able to continue It accomplishes this with the help of its
leading Valor to further development. LORD Corporation expands Value-Added Technical Support Team.
electronic materials laboratories, FINE LINE STENCIL adopts a
Tensilica names new CEO as R&D center consultative approach with customers
Rowen shifts to CTO role LORD Corporation recently made US $2.5 in order to provide the best tailored
Tensilica appointed Jack Guedj CEO million in renovations to its electronic service. Typically this involves design
as company founder Chris Rowen materials labs in Cary, NC, to consolidate stage discussions, materials evaluation
resigned the seat, moving to the labs previously located in Elverson, PA, and selection, technology selection, and
position of CTO. Guedj comes to the and Indianapolis, IN, with the Cary optimization of design for process. The
customizable processors and IP core location. The expansion includes roughly team’s engineers bring years of experience
company after serving as president and 7500 square feet of new or refurbished lab in contract manufacturing assembly and
CEO of Magnum Semiconductor. Guedj space and more than $600,000 in newly are well versed in all aspects of stencil
spun Magnum out of Cirrus Logic in installed instruments and equipment. and PCB design. However, the company’s
2005 and led Magnum’s growth from its Examples of new instruments include a expertise is not limited to just these areas.
founding stage through the acquisition Sonix fusion scanning acoustic microscope, It also can offer assistance when dealing
of LSI Logic’s consumer product group Yestech YTX 3000 x-ray and a Keyence with problems beyond the stencil printer,
in 2007. 5000X digital microscope.
www.lord.com such as pick-and-place and reflow.
www.finelinestencil.com
Birth of a mobile-handset
powerhouse
Epcos AG’s recent acquisition of NXP
Semiconductor’s Radio-Frequency
Microelectromechanical Systems (RF
MEMS) business establishes the company
10 – Global SMT & Packaging - August 2008
www.globalsmt.net
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